JPS5921095A - 多層印刷配線板の製造方法 - Google Patents
多層印刷配線板の製造方法Info
- Publication number
- JPS5921095A JPS5921095A JP13098782A JP13098782A JPS5921095A JP S5921095 A JPS5921095 A JP S5921095A JP 13098782 A JP13098782 A JP 13098782A JP 13098782 A JP13098782 A JP 13098782A JP S5921095 A JPS5921095 A JP S5921095A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- photosensitive thermosetting
- printed wiring
- thermosetting resist
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 18
- 229920001187 thermosetting polymer Polymers 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 206010011732 Cyst Diseases 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- 208000031513 cyst Diseases 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229960003280 cupric chloride Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- VKEQBMCRQDSRET-UHFFFAOYSA-N Methylone Chemical compound CNC(C)C(=O)C1=CC=C2OCOC2=C1 VKEQBMCRQDSRET-UHFFFAOYSA-N 0.000 description 1
- 210000003323 beak Anatomy 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13098782A JPS5921095A (ja) | 1982-07-27 | 1982-07-27 | 多層印刷配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13098782A JPS5921095A (ja) | 1982-07-27 | 1982-07-27 | 多層印刷配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5921095A true JPS5921095A (ja) | 1984-02-02 |
| JPH0380359B2 JPH0380359B2 (en]) | 1991-12-24 |
Family
ID=15047264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13098782A Granted JPS5921095A (ja) | 1982-07-27 | 1982-07-27 | 多層印刷配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5921095A (en]) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5984494A (ja) * | 1982-11-06 | 1984-05-16 | 東芝ケミカル株式会社 | 多層プリント配線板の製造方法 |
| JPS60233653A (ja) * | 1984-05-07 | 1985-11-20 | Stanley Electric Co Ltd | 写真蝕刻方法 |
| JPS62147798A (ja) * | 1985-12-23 | 1987-07-01 | 東芝ケミカル株式会社 | 多層プリント配線板 |
| US5326233A (en) * | 1992-07-03 | 1994-07-05 | Mitsubishi Denki Kabushiki Kaisha | Enclosed motor compressor of a two cylinder type |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58197898A (ja) * | 1982-05-14 | 1983-11-17 | 東芝ケミカル株式会社 | 多層プリント配線板の製造方法 |
-
1982
- 1982-07-27 JP JP13098782A patent/JPS5921095A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58197898A (ja) * | 1982-05-14 | 1983-11-17 | 東芝ケミカル株式会社 | 多層プリント配線板の製造方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5984494A (ja) * | 1982-11-06 | 1984-05-16 | 東芝ケミカル株式会社 | 多層プリント配線板の製造方法 |
| JPS60233653A (ja) * | 1984-05-07 | 1985-11-20 | Stanley Electric Co Ltd | 写真蝕刻方法 |
| JPS62147798A (ja) * | 1985-12-23 | 1987-07-01 | 東芝ケミカル株式会社 | 多層プリント配線板 |
| US5326233A (en) * | 1992-07-03 | 1994-07-05 | Mitsubishi Denki Kabushiki Kaisha | Enclosed motor compressor of a two cylinder type |
| US5678299A (en) * | 1992-07-03 | 1997-10-21 | Mitsubishi Denki Kabushiki Kaisha | Method for assembling an enclosed motor compressor of a two cylinder type using integral structures |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0380359B2 (en]) | 1991-12-24 |
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